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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6446-B Issued Date : 1992.11.25 Revised Date : 2000.09.20 Page No. : 1/4 HBC237 NPN EPITAXIAL PLANAR TRANSISTOR Description The HBC237 is primarily intended for in driver stage of audio amplifiers. Features High Breakdown Voltage: 45V at IC=2mA Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 400 mW * Maximum Voltages and Currents (Ta=25C) VCES Collector to Emitter Voltage...................................................................................... 50 V VCEO Collector to Emitter Voltage ..................................................................................... 45 V VEBO Emitter to Base Voltage ............................................................................................. 5 V IC Collector Current ...................................................................................................... 100 mA Characteristics (Ta=25C, *Pulse Test : Pulse Width 380us, Duty Cycle2%) Symbol BVCES BVCEO BVEBO ICES IEBO VBE(on) *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 fT Cob Min. 50 45 6 550 50 120 60 150 Typ. Max. 15 100 700 200 600 1.05 830 800 4.5 Unit V V V nA nA mV mV mV V mV Test Conditions IC=100uA, VEB=0 IC=2mA, IB=0 IE=100uA, IC=0 VCB=50V, IE=0 VEB=4V, IC=0 IC=2mA, VCE=5V IC=10mA, IB=0.5mA IC=100mA, IB=5mA IC=100mA, IB=5mA IC=10mA, IB=0.5mA VCE=5V, IC=10uA VCE=5V, IC=2mA VCE=5V, IC=100mA VCE=5V, IC=10mA, f=100MHz VCB=10V, IE=0, f=1MHz MHz PF Classification of hFE2 Rank Range A 120-220 B 180-460 C 300-800 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 100 Spec. No. : HE6446-B Issued Date : 1992.11.25 Revised Date : 2000.09.20 Page No. : 2/4 Saturation Voltage & Collector Current VCE=5V 100 Saturation Voltage (mV) 10 hFE 1 VBE(sat) @ IC=10IB 0.1 @ IC=10IB VCE(sat) 10 1 10 100 1000 0.01 1 10 Collector Current (mA) 100 Collector Current (mA) 1000 10000 On Voltage & Collector Current 10 1000 Cutoff Frequency & Collector Current Cutoff Frequency (MHz) VCE=5V 100 On Voltage (mV) 1 VBE(on) @ VCE=5V 10 0.1 1 10 100 1000 1 1 10 100 Collector Current (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 10 10 Safe Operating Area PT=1ms Collector Current (mA) Capacitance (Pf) 1 PT=100ms PT=1s 0.1 Cob 1 1 10 100 0.01 1 10 100 Reverse Biased Voltage (V) Forward Voltage (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6446-B Issued Date : 1992.11.25 Revised Date : 2000.09.20 Page No. : 3/4 PD-Ta 450 400 Power Dissipation-PD(mW) 350 300 250 200 150 100 50 0 0 50 100 o 150 200 Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 12 3 Spec. No. : HE6446-B Issued Date : 1992.11.25 Revised Date : 2000.09.20 Page No. : 4/4 2 Marking : HSMC Logo Part Number Date Code Rank Product Series 3 Laser Mark HSMC Logo Product Series C D Part Number H I E F G Ink Mark Style : Pin 1.Collector 2.Base 3.Emitter 1 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification |
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